이 누리집은 대한민국 공식 전자정부 누리집입니다.
Biz News Korea(Eng)
Samsung Electro-mechanics readies fan-out chip packaging
- Collected
- 2016.07.06
- Distributed
- 2016.07.07
- Source
- Go Direct
For this year, the company pins hope on camera module business. Sales will likely grow as Chinese smartphone manufacturers such as Huawei, Xiaomi, Lenovo and Oppo, and Korean makers all now opt for more lucrative high-resolution and dual camera module. The Samsung company reportedly supplied the dual camera module for Xiaomi in its new flagship Mi Note 2 that would come out in the second half.
Venturing into the semiconductor packaging business, the company has been renovating production lines of Samsung Display Co. located in Cheonan in the northeast corner of South Chungcheon Province for the purpose. It joined up with Samsung Electronics to develop a next-generation packaging technology called Fan out Wafer Level Package (FoWLP).
The fan-out packaging technology is advanced form that can be used for multiple die and since it does not require substrate and can be done in a foundry, it can significantly reduce the cost in chip-making and the area of packaging. The technology is patented by Taiwan-based Taiwan Semiconductor Manufacturing Company (TSMC). TSMC provides the entire supplies of application processor A10 chip, a core part of Apple’s iPhone 7.
“By adding the advanced semiconductor packaging technology, Samsung Electro-mechanics could help Samsung Electronics raise competitiveness on application chips and obtain orders from major smartphone manufacturers like Apple,” said an official of the industry.
By Lee Seung-hoon
[ⓒ Pulse by Maeil Business News Korea & mk.co.kr, All rights reserved]